Electromigration of intergranular voids in metal films for microelectronic interconnects. (Q1873405)
From MaRDI portal
scientific article
Language | Label | Description | Also known as |
---|---|---|---|
English | Electromigration of intergranular voids in metal films for microelectronic interconnects. |
scientific article |
Statements
Electromigration of intergranular voids in metal films for microelectronic interconnects. (English)
0 references
20 May 2003
0 references
finite difference scheme
0 references
Runge-Kutta integration scheme
0 references
static Laplace equation
0 references
0 references
0 references
0 references