An Approximate Analysis of Stresses in Multilayered Elastic Thin Films

DOI10.1115/1.3173620MaRDI QIDQ3814908zbMATH OpenOpenAlexFDO

Authors E. Suhir

Publication date 1988

Published in Journal of Applied Mechanics (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1115/1.3173620

zbMATH Keywords

interfacial stressesnormal stressessingle and multilayered heteroepitaxial structuresthick substrates

Mathematics Subject Classification ID

Thermal effects in solid mechanics (74F05) Numerical and other methods in solid mechanics (74S99)

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(8)

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• Thermoelastic analysis of periodic thin lines deposited on a substrate
• Analysis of a pre-stressed bi-material accelerated-life-test (ALT) specimen
• Thermoelastic stress analysis of multilayered films in a micro-thermoelectric cooling device
• Micron-scale channel formation by the release and Bond-back of pre-stressed thin films: a finite element analysis
• Analysis of interfacial thermal stresses of chip-substrate structure
• Thickness effect of a thin film on the stress field due to the eigenstrain of an ellipsoidal inclusion
• Validation of stresses and stress intensity factor in a notched bilayer system under four point bending, as determined by the solution of the Navier's equation

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