Finite element analysis of nonlinear fully coupled thermoelectric materials
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This paper presents a complete analysis of thermoelectric materials of simple configurations, which are of practical interest. In particular, the authors analyze prismatic thermoelements of a commercial Peltier cell. The presented numerical results could be very useful for the design of semiconductors.
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Cites work
Cited in
(20)- Iterative method for matching solutions to the heat balance equations for different parts of a thermoelectric cooler
- Thermoelectric fields and associated thermal stresses for an inclined elliptic hole in thermoelectric materials
- A coupled electro-thermal discontinuous Galerkin method
- Finite element analysis and material sensitivity of \textit{Peltier} thermoelectric cells coolers
- Analysis of three-dimensional ellipsoidal inclusions in thermoelectric solids
- Perturbation of the elastic and thermoelectric fields caused by a rigid inclusion in a thermo-electro-elastic full plane
- On coupling contact analysis of thermoelectric materials
- Plasticity coupled with thermo-electric fields: thermodynamics framework and finite element method computations
- Analytical and numerical treatment of electro-thermo-mechanical coupling
- Electric-current-induced thermal stress around a non-circular rigid inclusion in a two-dimensional nonlinear thermoelectric material
- An algorithm of calculating transport parameters of thermoelectric materials using single band model with optimized integration methods
- Geometrical design of thermoelectric generators based on topology optimization
- Link element with varying conductance for thermo-electric analysis
- scientific article; zbMATH DE number 1210709 (Why is no real title available?)
- Non-linear finite element formulation applied to thermoelectric materials under hyperbolic heat conduction model
- Multiphysics and thermodynamic formulations for equilibrium and non-equilibrium interactions: non-linear finite elements applied to multi-coupled active materials
- Interfacial behavior of a thermoelectric film bonded to a graded substrate
- A novel numerical strategy for modeling the moving boundary value problem of electrochemical machining
- Nonlocal numerical simulation of thermoelectric coupling field by using peridynamic differential operator
- Study of a thermoelement's behaviour through a modelling based on electrical analogy
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