Interconnects in VLSI design
The articles of this volume will not be indexed individually.NEWLINENEWLINENEWLINEFrom the introduction: This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemünde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999.NEWLINENEWLINENEWLINEThis publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continuation and a supplement to the first book ``Signal Propagation on Interconnects, Kluwer Academic Publishers, 1998.NEWLINENEWLINENEWLINEThe papers in this book cover a wide area of research directions: Beneath the description of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects.
- Physical design of the VCI wrappers for the on-chip packet-switched network named SPIN
- Performance optimization of VLSI interconnect layout
- Recent advances in modeling and simulation of high-speed interconnects
- scientific article; zbMATH DE number 2017833 (Why is no real title available?)
- scientific article; zbMATH DE number 750011 (Why is no real title available?)
- Computational Science – ICCS 2005
- Effective dynamics and blow up in a model of magnetic relaxation
- Rate of convergence of a semi-implicit time Euler scheme for a 2D Bénard-Boussinesq model
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