Models of void electromigration
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Recommendations
- Computation for electromigration in interconnects of microelectronic devices
- Electromigration of intergranular voids in metal films for microelectronic interconnects.
- An unfitted finite element method for the numerical approximation of void electromigration
- A numerical study of electro-migration voiding by evolving level set functions on a fixed Cartesian grid
- Numerical simulation of nucleation and migration voids of interconnects of electrical circuits
Cited in
(13)- Creep flow, diffusion, and electromigration in small scale interconnects
- A theoretical analysis of the electromigration-induced void morphological evolution under high current density
- Electromigration of intergranular voids in metal films for microelectronic interconnects.
- A moving boundary problem motivated by electric breakdown. I: Spectrum of linear perturbations
- A phase field model for the electromigration of intergranular voids
- An unfitted finite element method for the numerical approximation of void electromigration
- A fitted finite element method for the numerical approximation of void electro-stress migration
- Numerical simulation of nucleation and migration voids of interconnects of electrical circuits
- Finite Element Approximation of a Phase Field Model for Void Electromigration
- Void growth in metal anodes in solid-state batteries: recent progress and gaps in understanding
- Finite element approximation of a three dimensional phase field model for void electromigration
- The isoperimetric inequality via approximation theory and free boundary problems
- A moving boundary model motivated by electric breakdown. II: Initial value problem
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