Computation for electromigration in interconnects of microelectronic devices
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Cites work
- A finite element analysis of the motion and evolution of voids due to strain and electromigration induced surface diffusion
- A level set approach for computing solutions to incompressible two-phase flow
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- A level set approach to a unified model for etching, deposition, and lithography. II: Three-dimensional simulations
- A level set approach to a unified model for etching, deposition, and lithography. III: Redeposition, reemission, surface diffusion, and complex simulations
- A numerical study of electro-migration voiding by evolving level set functions on a fixed Cartesian grid
- A variational level set approach to multiphase motion
- An Efficient, Interface-Preserving Level Set Redistancing Algorithm and Its Application to Interfacial Incompressible Fluid Flow
- Black box multigrid
- Black box multigrid for nonsymmetric problems
- Curvature and the evolution of fronts
- Efficient implementation of essentially nonoscillatory shock-capturing schemes
- Efficient implementation of essentially nonoscillatory shock-capturing schemes. II
- Front tracking and two-dimensional Riemann problems
- High-Order Essentially Nonoscillatory Schemes for Hamilton–Jacobi Equations
- scientific article; zbMATH DE number 3930566 (Why is no real title available?)
- scientific article; zbMATH DE number 4078694 (Why is no real title available?)
- scientific article; zbMATH DE number 18258 (Why is no real title available?)
- scientific article; zbMATH DE number 1302349 (Why is no real title available?)
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- scientific article; zbMATH DE number 3259330 (Why is no real title available?)
- scientific article; zbMATH DE number 3200428 (Why is no real title available?)
- Linking anisotropic sharp and diffuse surface motion laws via gradient flows
- Multi-Level Adaptive Solutions to Boundary-Value Problems
- The Multi-Grid Method for the Diffusion Equation with Strongly Discontinuous Coefficients
Cited in
(16)- Creep flow, diffusion, and electromigration in small scale interconnects
- A numerical study of electro-migration voiding by evolving level set functions on a fixed Cartesian grid
- Surface evolution in bare bamboo-type metal lines under diffusion and electric field effects
- A numerical model of stress driven grain boundary diffusion.
- A phase field model for failure in interconnect lines due to coupled diffusion mechanisms.
- Monte Carlo simulation of electromigration phenomena in metallic lines
- Electromigration of intergranular voids in metal films for microelectronic interconnects.
- Three-dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion
- Irreversible thermodynamics of triple junctions during the intergranular void motion under the electromigration forces
- Electromigration failure of metal lines
- An unfitted finite element method for the numerical approximation of void electromigration
- A fitted finite element method for the numerical approximation of void electro-stress migration
- Models of void electromigration
- Numerical simulation of nucleation and migration voids of interconnects of electrical circuits
- The level-set method applied to droplet dynamics in the presence of an electric field
- Numerical simulation of grain-boundary grooving by level set method
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