Characteristic finite difference fractional step methods for three-dimensional semiconductor device of heat conduction
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Publication:1428902
DOI10.1007/BF02884655zbMATH Open1036.82519MaRDI QIDQ1428902FDOQ1428902
Authors: Yirang Yuan 
Publication date: 18 May 2004
Published in: Chinese Science Bulletin (Search for Journal in Brave)
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Cites Work
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- Finite difference method and analysis for three-dimensional semiconductor device of heat conduction
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- Finite Difference Methods for Two-Phase Incompressible Flow in Porous Media
- Time-dependent solutions of a nonlinear system arising in semiconductor theory—II. Boundedness and periodicity
Cited In (10)
- Characteristic difference methods and \(L^\infty\)-error estimates for the semiconductor device of two dimensions
- Title not available (Why is that?)
- Title not available (Why is that?)
- A Numerical Approximation Structured by Mixed Finite Element and Upwind Fractional Step Difference for Semiconductor Device with Heat Conduction and Its Numerical Analysis
- Title not available (Why is that?)
- Title not available (Why is that?)
- Modification of upwind finite difference fractional step methods by the transient state of the semiconductor device
- Finite difference fractional step methods for the transient behavior of a semiconductor device
- A mixed-finite volume element coupled with the method of characteristic fractional step difference for simulating transient behavior of semiconductor device of heat conductor and its numerical analysis
- A finite difference scheme for three-dimensional semiconductor device of heat conduction on composite triangular grids
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