Mode-dependent toughness and the delamination of compressed thin films
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Publication:1584900
DOI10.1016/S0022-5096(00)00007-7zbMath0992.74051WikidataQ59923846 ScholiaQ59923846MaRDI QIDQ1584900
Publication date: 6 November 2000
Published in: Journal of the Mechanics and Physics of Solids (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/s0022-5096(00)00007-7
bifurcations; buckle-driven delamination; compressed thin films; blister; film/substrate interface; mode dependence
Related Items
Self-similar folding patterns and energy scaling in compressed elastic sheets, Nonlinear analyses of wrinkles in a film bonded to a compliant substrate, Asymptotic study of the interfacial crack with friction, ON A NONLOCAL FUNCTIONAL ARISING IN THE STUDY OF THIN-FILM BLISTERING
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