Mode-dependent toughness and the delamination of compressed thin films
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Publication:1584900
DOI10.1016/S0022-5096(00)00007-7zbMATH Open0992.74051OpenAlexW1993139532WikidataQ59923846 ScholiaQ59923846MaRDI QIDQ1584900FDOQ1584900
Authors: B. Audoly
Publication date: 6 November 2000
Published in: Journal of the Mechanics and Physics of Solids (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/s0022-5096(00)00007-7
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bifurcationsbuckle-driven delaminationcompressed thin filmsblisterfilm/substrate interfacemode dependence
Cites Work
- Crumpled paper
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- Mixed Mode Cracking in Layered Materials
- An asymptotic analysis of stationary and moving cracks with frictional contact along bimaterial interfaces and homogeneous solids
- One dimensional modelling of failure in laminated plates by delamination buckling
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- Effect of friction on the interface crack loaded in shear
- Asymptotic study of the interfacial crack with friction
- The effect of interfacial friction on the buckle-driven spontaneous delamination of a compressed thin film
Cited In (9)
- The Mexican hat effect on the delamination buckling of a compressed thin film
- Self-similar folding patterns and energy scaling in compressed elastic sheets
- Calculations of buckle-driven delamination using cohesive elements
- Delamination of compressed thin layers at corners
- On a nonlocal functional arising in the study of thin-film blistering
- Asymptotic study of the interfacial crack with friction
- Nonlinear analyses of wrinkles in a film bonded to a compliant substrate
- Material compressibility effects for the squeeze of very thin films
- Title not available (Why is that?)
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