Influence of interfacial delamination on channel cracking of elastic thin films
From MaRDI portal
Publication:1956183
DOI10.1007/S10704-008-9205-7zbMATH Open1264.74225OpenAlexW2064355807MaRDI QIDQ1956183FDOQ1956183
Haixia Mei, Yaoyu Pang, Rui Huang
Publication date: 13 June 2013
Published in: International Journal of Fracture (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1007/s10704-008-9205-7
Cites Work
- Mixed Mode Cracking in Layered Materials
- Application of fracture mechanics concepts to hierarchical biomechanics of bone and bone-like materials
- Ductility of thin metal films on polymer substrates modulated by interfacial adhesion
- Energy-Release Rate and Crack Kinking Under Combined Loading
- Delamination in patterned films
- Kinetics of crack initiation and growth in organic-containing integrated structures
Cited In (6)
- Crack in an elastic thin-film with surface effect
- Micron-scale channel formation by the release and Bond-back of pre-stressed thin films: a finite element analysis
- Interface cracking behavior in high-temperature coatings with non-uniformly distributed segmentation cracks
- Channel cracking in inelastic film/substrate systems
- Interaction between cracking, delamination and buckling in brittle elastic thin films
- Application of general regression neural network in identifying interfacial parameters under mixed-mode fracture
This page was built for publication: Influence of interfacial delamination on channel cracking of elastic thin films
Report a bug (only for logged in users!)Click here to report a bug for this page (MaRDI item Q1956183)
