Micron-scale channel formation by the release and Bond-back of pre-stressed thin films: a finite element analysis
DOI10.1016/J.JMPS.2010.02.004zbMATH Open1244.74054OpenAlexW2146776983MaRDI QIDQ442005FDOQ442005
W. T. S. Huck, Patrick R. Onck, R. K. Annabattula
Publication date: 8 August 2012
Published in: Journal of the Mechanics and Physics of Solids (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.jmps.2010.02.004
finite element analysisthin filmsbuckle-driven delaminationmicro/nano-fluidic channelsrelease-and-Bond-back
Thin films (74K35) Finite element methods applied to problems in solid mechanics (74S05) Bifurcation and buckling (74G60)
Cites Work
Cited In (1)
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