Pages that link to "Item:Q1655061"

The following pages link to Singularity analysis of planar cracks in three-dimensional piezoelectric semiconductors via extended displacement discontinuity boundary integral equation method (Q1655061):

Displaying 10 items.

• Iterative boundary element method for crack analysis of two-dimensional piezoelectric semiconductor (Q1655978) (← links)
• Extended displacement discontinuity method for analysis of penny-shaped cracks in three-dimensional thermal piezoelectric semiconductors (Q1788375) (← links)
• Analysis of a penny-shaped crack with semi-permeable boundary conditions across crack face in a 3D thermal piezoelectric semiconductor (Q1980144) (← links)
• Numerical solutions of hypersingular integral equations for interface circular crack under axisymmetric loadings (Q2223897) (← links)
• Nonlinear solutions of PN junctions of piezoelectric semiconductors (Q2285507) (← links)
• A modified singular boundary method for three-dimensional high frequency acoustic wave problems (Q2295064) (← links)
• Analysis of arbitrarily shaped planar cracks in two-dimensional hexagonal quasicrystals with thermal effects. I: Theoretical solutions (Q2295292) (← links)
• Extension of a piezoelectric semiconductor fiber with consideration of electrical nonlinearity (Q2296369) (← links)
• BEM analysis for curved cracks (Q2662434) (← links)
• Electromechanical field analysis of PN junctions in bent composite piezoelectric semiconductor beams under shear forces (Q6490818) (← links)