Pages that link to "Item:Q2468800"

The following pages link to A phase field model for the electromigration of intergranular voids (Q2468800):

Displaying 10 items.

• A fitted finite element method for the numerical approximation of void electro-stress migration (Q268875) (← links)
• Numerical simulation and linear well-posedness analysis for a class of three-phase boundary motion problems (Q421821) (← links)
• The influence of electric fields on nanostructures-simulation and control (Q975016) (← links)
• Numerical simulations of immiscible fluid clusters (Q1021629) (← links)
• Phase field simulation of healing and growth of voids in interconnects under electric field-induced interface migration (Q2134405) (← links)
• An unfitted finite element method for the numerical approximation of void electromigration (Q2517475) (← links)
• Sharp-Interface Limits of the Cahn--Hilliard Equation with Degenerate Mobility (Q2790415) (← links)
• The approximation of planar curve evolutions by stable fully implicit finite element schemes that equidistribute (Q3068787) (← links)
• Finite-element approximation of coupled surface and grain boundary motion with applications to thermal grooving and sintering (Q3068797) (← links)
• A structure‐preserving finite element approximation of surface diffusion for curve networks and surface clusters (Q6090444) (← links)