The following pages link to Ming-Hao Zhao (Q985227):
Displayed 50 items.
- Item:Q985227 (redirect page) (← links)
- Analysis of an arbitrarily oriented crack in a finite piezoelectric plane via the hybrid extended displacement discontinuity-fundamental solution method (Q360283) (← links)
- Item:Q985227 (redirect page) (← links)
- Solution method of interface cracks in three-dimensional transversely isotropic piezoelectric bimaterials (Q443287) (← links)
- Hybrid extended displacement discontinuity-charge simulation method for analysis of cracks in 2D piezoelectric media (Q443469) (← links)
- Nonlinear solution of the PS model for a semi-permeable crack in a 3D piezoelectric medium (Q463557) (← links)
- Item:Q985227 (redirect page) (← links)
- Strip electric-magnetic breakdown model in a magnetoelectroelastic medium (Q731135) (← links)
- Analysis of anti-plane interface cracks in one-dimensional hexagonal quasicrystal coating (Q821713) (← links)
- Application of the homotopy analysis method to nonlinear characteristics of a piezoelectric semiconductor fiber (Q825373) (← links)
- Interfacial crack analysis in three-dimensional transversely isotropic bi-materials by boundary integral equation method (Q957617) (← links)
- Numerical solution of polarization saturation/dielectric breakdown model in 2D finite piezoelectric media (Q985228) (← links)
- Analysis method of planar interface cracks of arbitrary shape in three-dimensional transversely isotropic magnetoelectroelastic bimaterials (Q1013860) (← links)
- The analysis of crack problems with nonlocal elasticity (Q1305366) (← links)
- Fundamental solutions of uniform loads over triangular elements in a three-dimensional piezoelectric medium (Q1634029) (← links)
- Improved integration scheme for the second-order consistent element-free Galerkin method (Q1634639) (← links)
- Displacement discontinuity analysis of a nonlinear interfacial crack in three-dimensional transversely isotropic magneto-electro-elastic bi-materials (Q1654860) (← links)
- Singularity analysis of planar cracks in three-dimensional piezoelectric semiconductors via extended displacement discontinuity boundary integral equation method (Q1655061) (← links)
- Iterative boundary element method for crack analysis of two-dimensional piezoelectric semiconductor (Q1655978) (← links)
- An iterative approach for analyzing cracks in two-dimensional piezoelectric media with exact boundary conditions (Q1657114) (← links)
- Verifiable outsourced ciphertext-policy attribute-based encryption in cloud computing (Q1703692) (← links)
- Extended displacement discontinuity method for analysis of penny-shaped cracks in three-dimensional thermal piezoelectric semiconductors (Q1788375) (← links)
- Efficient and secure outsourced approximate pattern matching protocol (Q1797787) (← links)
- The method of analysis of crack problem in three-dimensional non-local elasticity (Q1818156) (← links)
- Extended displacement discontinuity Green's functions for three-dimensional transversely isotropic magneto-electro-elastic media and applications (Q1958337) (← links)
- The strip dielectric breakdown model (Q1959855) (← links)
- Mechanics of shaft-loaded blister test for thin film suspended on compliant substrate (Q1959987) (← links)
- The method of analysis of cracks in three-dimensional transversely isotropic media: Boundary intergral equation approach (Q1961147) (← links)
- Dugdale model solutions for a penny-shaped crack in three-dimensional transversely isotropic piezoelectric media by boundary integral equation method (Q1961542) (← links)
- Analysis of a penny-shaped crack with semi-permeable boundary conditions across crack face in a 3D thermal piezoelectric semiconductor (Q1980144) (← links)
- A meshfree method with gradient smoothing for free vibration and buckling analysis of a strain gradient thin plate (Q1980200) (← links)
- An efficient iteration approach for nonlinear boundary value problems in 2D piezoelectric semiconductors (Q1985015) (← links)
- Markov chain analysis of evolutionary algorithms on OneMax function -- from coupon collector's problem to (1 + 1) EA (Q1989355) (← links)
- Oblivious DFA evaluation on joint input and its applications (Q2023228) (← links)
- Secure extended wildcard pattern matching protocol from cut-and-choose oblivious transfer (Q2023253) (← links)
- Interfacial fracture analysis for a two-dimensional decagonal quasi-crystal coating layer structure (Q2165101) (← links)
- Consistent integration schemes for meshfree analysis of strain gradient elasticity (Q2179218) (← links)
- Numerical method of crack analysis in 2D finite magnetoelectroelastic media (Q2268479) (← links)
- Boundary integral equation method for conductive cracks in two and three-dimensional transversely isotropic piezoelectric media (Q2269248) (← links)
- Nonlinear solutions of PN junctions of piezoelectric semiconductors (Q2285507) (← links)
- Analysis of arbitrarily shaped planar cracks in two-dimensional hexagonal quasicrystals with thermal effects. II: Numerical solutions (Q2295291) (← links)
- Analysis of arbitrarily shaped planar cracks in two-dimensional hexagonal quasicrystals with thermal effects. I: Theoretical solutions (Q2295292) (← links)
- Analysis solution method for 3D planar crack problems of two-dimensional hexagonal quasicrystals with thermal effects (Q2310567) (← links)
- Fundamental solutions and analysis of the interface crack for two-dimensional decagonal quasicrystal bimaterial via the displacement discontinuity method (Q2325479) (← links)
- Analysis of elastic-plastic fracture in two-dimensional decagonal quasicrystals using the displacement discontinuity method (Q2334255) (← links)
- Analysis method of planar cracks of arbitrary shape in the isotropic plane of a three-dimensional transversely isotropic magnetoelectroelastic medium (Q2382922) (← links)
- Extended displacement discontinuity method for nonlinear analysis of penny-shaped cracks in three-dimensional piezoelectric media (Q2450951) (← links)
- Boundary integral-differential equations and boundary element method for interfacial cracks in three-dimensional piezoelectric media (Q2486459) (← links)
- Three-dimensional extended displacement discontinuity method for vertical cracks in transversely isotropic piezoelectric media (Q2520202) (← links)
- Enabling cloud storage auditing with key-exposure resilience under continual key-leakage (Q2660966) (← links)