Analysis of a penny-shaped crack with semi-permeable boundary conditions across crack face in a 3D thermal piezoelectric semiconductor
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Publication:1980144
DOI10.1016/j.enganabound.2021.06.013OpenAlexW3186829813MaRDI QIDQ1980144
ChangHai Yang, Chunsheng Lu, Qiaoyun Zhang, Ming-Hao Zhao
Publication date: 3 September 2021
Published in: Engineering Analysis with Boundary Elements (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.enganabound.2021.06.013
penny-shaped crackpiezoelectric semiconductorextended stress intensity factorssemi-permeable boundary condition
Cites Work
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- Extended displacement discontinuity method for analysis of penny-shaped cracks in three-dimensional thermal piezoelectric semiconductors
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- Finite-part integral and boundary element method to solve three-dimensional crack problems in piezoelectric materials
- A mode III crack in a piezoelectric semiconductor of crystals with 6 mm symmetry
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