Boundary element method applied to three dimensional thermoelastic contact
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Cites work
Cited in
(21)- Incremental finite element equations for thermomechanical response of elastomers: Effect of boundary conditions including contact
- Analyzing the load distribution of four-row tapered roller bearing with boundary element method
- BEM calculation of the complex thermal impedance of microelectronic devices
- Stress analysis of three-dimensional contact problems using the boundary element method
- Size-dependent contact mechanics via boundary element analysis
- A boundary element procedure to analyze the thermomechanical contact problem in 3D microelectronic packaging
- Thermoelastic influence of convective and conduction interstitial conditions on the size of the contact zone in three-dimensional receding thermoelastic contact problem
- The effect of conduction and convective conditions at interstitial regions on 3D thermoelastic contact problems
- Penalty method for three-dimensional elastic contact problems by boundary element method
- scientific article; zbMATH DE number 994798 (Why is no real title available?)
- scientific article; zbMATH DE number 3876757 (Why is no real title available?)
- scientific article; zbMATH DE number 4203917 (Why is no real title available?)
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- 3D thermoelastic solids under non‐linear interface thermal and orthotropic frictional contact conditions
- A study of the radiation thermal boundary conditions influence in three-dimensional thermomechanical contact problems
- BEM formulation for simulating heat dissipation in microelectronic packaging with point heat sources
- A systematic solution based on the half-space concept for modeling of thermoelastic contact between bodies defined by curved free boundaries
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