Numerical method of mixed finite volume-modified upwind fractional step difference for three-dimensional semiconductor device transient behavior problems
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Publication:2408873
DOI10.1016/S0252-9602(16)30129-1zbMath1399.65201MaRDI QIDQ2408873
Qing Yang, Tong-jun Sun, Chang-Feng Li, Yi-Rang Yuan
Publication date: 20 October 2017
Published in: Acta Mathematica Scientia. Series B. (English Edition) (Search for Journal in Brave)
heat conduction problem; mixed finite volume element; modified upwind fractional step difference; second-order error; three dimensional transient behavior
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