Spatial defect pattern recognition on semiconductor wafers using model-based clustering and Bayesian inference

DOI10.1016/J.EJOR.2007.06.007MaRDI QIDQ2482829zbMATH OpenOpenAlexFDO

Authors Tao Yuan, Way Kuo

Publication date 24 April 2008

Published in European Journal of Operational Research (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/j.ejor.2007.06.007

zbMATH Keywords

stochastic processespattern recognitionquality controlsemiconductor manufacturing

Mathematics Subject Classification ID

Production models (90B30) Spatial models in economics (91B72)

Recommendations

• Automatic identification of spatial defect patterns for semiconductor manufacturing
• Monitoring Wafer Map Data from Integrated Circuit Fabrication Processes for Spatially Clustered Defects
• Wafer defect detection using directional morphological gradient techniques

Cites work

• scientific article; zbMATH DE number 3892434 (Why is no real title available?)
• An introduction to the theory of point processes
• Detecting Features in Spatial Point Processes with Clutter via Model-Based Clustering
• Estimating the dimension of a model
• Model-Based Clustering, Discriminant Analysis, and Density Estimation
• Model-Based Gaussian and Non-Gaussian Clustering
• Model-based clustering for integrated circuit yield enhancement
• Model-based clustering with noise: Bayesian inference and estimation
• Principal Curves
• Spatial defect pattern recognition on semiconductor wafers using model-based clustering and Bayesian inference

Cited in

(4)

• Automatic identification of spatial defect patterns for semiconductor manufacturing
• A self-growing hidden Markov tree for wafer map inspection
• Model-based clustering for integrated circuit yield enhancement
• Spatial defect pattern recognition on semiconductor wafers using model-based clustering and Bayesian inference

Describes a project that uses

Uses Software

• BayesDA

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