Analysis of vertical cracking phenomena in tensile-strained epitaxial film on a substrate. II. Application to inxga1 - xas/InP system
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Cites work
- Analysis of vertical cracking phenomena in tensile-strained epitaxial film on a substrate. I: Mathematical formulation
- Dependence of stress on elastic constants in an anisotropic bimaterial under plane deformation; and the interfacial crack
- Elastic study on singularities interacting with interfaces using alternating technique. I: Anisotropic trimaterial.
- Generalized Dundurs constants for anisotropic bimaterials
- Mixed Mode Cracking in Layered Materials
- Thin Film Materials
Cited in
(4)- Effect of elastic constants on crack channeling in a thin film bonded to an orthotropic substrate
- Mathematical model for simulation of indium segregation and mismatch stress in InGaAs/GaAs multiple QWs heterostructures
- Analysis of vertical cracking phenomena in tensile-strained epitaxial film on a substrate. I: Mathematical formulation
- Erratum to ``Analysis of vertical cracking phenomena in tensile-strained epitaxial film on a substrate: Part I. Mathematical formulation
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