Analysis of vertical cracking phenomena in tensile-strained epitaxial film on a substrate. II. Application to inxga1 - xas/InP system
DOI10.1016/J.IJSOLSTR.2007.08.037zbMATH Open1167.74552OpenAlexW2091331787MaRDI QIDQ833941FDOQ833941
Authors: Saebom Lee, Youn Y. Earmme, Seung Tae Choi 
Publication date: 14 August 2009
Published in: International Journal of Solids and Structures (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.ijsolstr.2007.08.037
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Cites Work
- Thin Film Materials
- Mixed Mode Cracking in Layered Materials
- Dependence of stress on elastic constants in an anisotropic bimaterial under plane deformation; and the interfacial crack
- Generalized Dundurs constants for anisotropic bimaterials
- Analysis of vertical cracking phenomena in tensile-strained epitaxial film on a substrate. I: Mathematical formulation
- Elastic study on singularities interacting with interfaces using alternating technique. I: Anisotropic trimaterial.
Cited In (4)
- Effect of elastic constants on crack channeling in a thin film bonded to an orthotropic substrate
- Mathematical model for simulation of indium segregation and mismatch stress in InGaAs/GaAs multiple QWs heterostructures
- Analysis of vertical cracking phenomena in tensile-strained epitaxial film on a substrate. I: Mathematical formulation
- Erratum to ``Analysis of vertical cracking phenomena in tensile-strained epitaxial film on a substrate: Part I. Mathematical formulation
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