Thin film/substrate systems featuring arbitrary film thickness and misfit strain distributions. I: Analysis for obtaining film stress from non-local curvature information
DOI10.1016/J.IJSOLSTR.2006.10.016zbMATH Open1331.74014OpenAlexW2153502028MaRDI QIDQ869280FDOQ869280
Authors: N. E. Zubov 
Publication date: 2 March 2007
Published in: International Journal of Solids and Structures (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.ijsolstr.2006.10.016
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Cited In (9)
- The role of the sample shape and size on the internal stress induced curvature of thin-film substrate systems
- Asymptotic analysis of an adhesive joint with mismatch strain
- Thin film/substrate systems featuring arbitrary film thickness and misfit strain distributions. II: Experimental validation of the non-local stress/curvature relations
- Non-uniform, axisymmetric misfit strain in thin films bonded on plate substrates/substrate systems: the relation between non-uniform film stresses and system curvatures
- Extension of Stoney's formula to non-uniform temperature distributions in thin film/substrate systems. The case of radial symmetry
- A microbeam bending method for studying stress-strain relations for metal thin films on silicon substrates
- Multi-layer thin films/substrate system subjected to non-uniform misfit strains
- Analysis of film strain and stress in a film-substrate cantilever system
- Residual stresses in silicon-on-sapphire thin film systems
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