Elastic thermal stresses in a circular overlay/rigid substrate system
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Publication:366716
DOI10.1016/J.MECHRESCOM.2011.04.005zbMath1272.74144OpenAlexW2090732656MaRDI QIDQ366716
Mohammad Hasan, M. Dambrine, H. S. Yoon
Publication date: 13 September 2013
Published in: Mechanics Research Communications (Search for Journal in Brave)
Full work available at URL: http://www.sciencedirect.com/science/article/pii/S0093641311000711
Analytic approximation of solutions (perturbation methods, asymptotic methods, series, etc.) of equilibrium problems in solid mechanics (74G10) Thermal effects in solid mechanics (74F05) Thin films (74K35)
Cites Work
- An explicit elastic solution for a brittle film with periodic cracks
- Multi-layer thin films/substrate system subjected to non-uniform misfit strains
- Fracture saturation and critical thickness in layered materials
- Micromechanics-based thermoelastic model for functionally graded particulate materials with particle interactions
- Prediction of thermal crack spacing
- Crack patterns in thin films
- Semi-analytical analysis of thermally induced damage in thin ceramic coatings
- Interfacial Stresses in Bimetal Thermostats
- Mixed Mode Cracking in Layered Materials
- Thin Film Materials
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