Elastic thermal stresses in a circular overlay/rigid substrate system

DOI10.1016/J.MECHRESCOM.2011.04.005zbMATH Open1272.74144OpenAlexW2090732656MaRDI QIDQ366716FDOQ366716

Authors: Z. F. Yuan, H. M. Yin 

Publication date: 13 September 2013

Published in: Mechanics Research Communications (Search for Journal in Brave)

Full work available at URL: http://www.sciencedirect.com/science/article/pii/S0093641311000711

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zbMATH Keywords

thermoelasticitythin filmthermal stressesaxisymmetrylayered materials

Mathematics Subject Classification ID

Thermal effects in solid mechanics (74F05) Thin films (74K35) Analytic approximation of solutions (perturbation methods, asymptotic methods, series, etc.) of equilibrium problems in solid mechanics (74G10)

Cites Work

• Thin Film Materials
• Prediction of thermal crack spacing
• Crack patterns in thin films
• Mixed Mode Cracking in Layered Materials
• Interfacial Stresses in Bimetal Thermostats
• Micromechanics-based thermoelastic model for functionally graded particulate materials with particle interactions
• Semi-analytical analysis of thermally induced damage in thin ceramic coatings
• An explicit elastic solution for a brittle film with periodic cracks
• Multi-layer thin films/substrate system subjected to non-uniform misfit strains
• Fracture saturation and critical thickness in layered materials

Cited In (4)

• Thermally induced deformations in die-substrate assembly
• Thermally induced deformations in a partially coated elastic layer
• Thermal ratcheting of solder-bonded layered plates: cyclic recovery and growth of deflection
• Thermal stresses in bilayer systems with weak interface

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