Burn-in considering yield loss and reliability gain for integrated circuits

DOI10.1016/j.ejor.2011.01.028zbMath1237.90066OpenAlexW1965086212MaRDI QIDQ421527

Kyungmee O. Kim

Publication date: 14 May 2012

Published in: European Journal of Operational Research (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.ejor.2011.01.028

zbMATH Keywords

reliabilitydefect growthdefect size distributionnegative binomial defect density

Mathematics Subject Classification ID

Reliability, availability, maintenance, inspection in operations research (90B25) Reliability and life testing (62N05)

Related Items (2)

Effects of manufacturing defects on the device failure rate ⋮ Adjacency-Clustering and Its Application for Yield Prediction in Integrated Circuit Manufacturing

Cites Work

• Burn-in and the performance quality measures in heterogeneous populations
• Optimal burn-in time to minimize the cost for general repairable products sold under warranty
• Burn-in by environmental shocks for two ordered subpopulations
• Optimal burn-in for maximizing reliability of repairable non-series systems
• A unified model incorporating yield, burn-in, and reliability
• A Criterion for Burn-in that Balances Mean Residual Life and Residual Variance
• The Optimal Burn-in: State of the Art and New Advances for Cost Function Formulation
• Optimal burn-in decision for products with an unimodal failure rate function

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