Pages that link to "Item:Q1589281"

The following pages link to A finite element analysis of the motion and evolution of voids due to strain and electromigration induced surface diffusion (Q1589281):

Displaying 22 items.

• A fitted finite element method for the numerical approximation of void electro-stress migration (Q268875) (← links)
• Analytical solution for motion of an elliptical inclusion in gradient stress field (Q443617) (← links)
• Phase field computations for surface diffusion and void electromigration in \({\mathbb{R}^3}\) (Q600929) (← links)
• Pore migration under high temperature and stress gradients (Q1009771) (← links)
• Instabilities of core-shell heterostructured cylinders due to diffusions and epitaxy: Spheroidization and blossom of nanowires (Q1025204) (← links)
• A numerical study of electro-migration voiding by evolving level set functions on a fixed Cartesian grid (Q1306116) (← links)
• Surface evolution in bare bamboo-type metal lines under diffusion and electric field effects (Q1399667) (← links)
• A theoretical analysis of the electromigration-induced void morphological evolution under high current density (Q1695572) (← links)
• Evolution of material voids for highly anisotropic surface energy (Q1780441) (← links)
• Electromigration of intergranular voids in metal films for microelectronic interconnects. (Q1873405) (← links)
• Three-dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion (Q1968692) (← links)
• Anisotropic phase field solution for morphological evolution and migration of inclusions in piezoelectric films (Q2009940) (← links)
• Phase field simulation of healing and growth of voids in interconnects under electric field-induced interface migration (Q2134405) (← links)
• Interface balance laws, phase growth and nucleation conditions for multiphase solids with inhomogeneous surface stress (Q2201584) (← links)
• Advances in the numerical treatment of grain-boundary migration: coupling with mass transport and mechanics (Q2459254) (← links)
• An unfitted finite element method for the numerical approximation of void electromigration (Q2517475) (← links)
• Finite element approximation of a phase field model for surface diffusion of voids in a stressed solid (Q5713216) (← links)
• A Symmetrized Parametric Finite Element Method for Anisotropic Surface Diffusion of Closed Curves (Q5889022) (← links)
• Computation for electromigration in interconnects of microelectronic devices (Q5937908) (← links)
• A lattice-based micromechanical continuum formulation for stress-driven mass transport in polycrystalline solids (Q5939627) (← links)
• A Symmetrized Parametric Finite Element Method for Anisotropic Surface Diffusion in Three Dimensions (Q6113942) (← links)
• Peridynamic modeling of void nucleation and growth in metal lines due to electromigration in a finite element framework (Q6171232) (← links)