Thermal-mechanical interface crack behaviour of a surface mount solder joint

DOI10.1016/S0168-874X(98)00028-6MaRDI QIDQ1274159zbMATH OpenOpenAlexFDO

Authors C. M. L. Wu, J. K. L. Lai, Yong-li Wu

Publication date 12 January 1999

Published in Finite Elements in Analysis and Design (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/s0168-874x(98)00028-6

zbMATH Keywords

\(J\)-integrallarge residual shear displacementlead-tin solder jointthermal effect

Mathematics Subject Classification ID

Finite element methods applied to problems in solid mechanics (74S05)

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Cited in

(14)

• Thermal stress and fatigue analysis of plated-through holes using an internal state variable constitutive model
• Process capability study and thermal fatigue life prediction of ceramic BGA solder joints
• Effect of geometric parameters on popcorn cracking in plastic packages during VPS process
• Parametric study of mode I energy release rate of soldered joints.
• Approximate solutions for the stresses in the solder joints of a printed circuit board subjected to mechanical bending
• Vapor pressure and residual stress effects on failure of an adhesive film
• Analytical elasto-creep model of interfacial thermal stresses and strains in trilayer assemblies
• Reexamination of the solder ball shear test for evaluation of the mechanical joint strength
• Finite element model analysis of thermal failure in connector
• Failure analysis of solder joints with a damage‐coupled viscoplastic model
• Implementation of the numerical manifold method for thermo-mechanical fracture of planar solids
• Analysis of fatigue delamination growth in flip-chip package
• Modeling thermal fatigue cracking in integrated circuits by level sets and the extended finite element method
• Thermal ratcheting of solder-bonded layered plates: cyclic recovery and growth of deflection

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